High-speed designs use digital components with very fast edge rates in their output signals which can be subjected to significant distortion and degradation creating high bit-error-rates and lower data throughput.  Insertion and reflection losses, crosstalk and impedance mismatch, are all factors, amongst others, influencing the integrity of a transmitted signal.

Empower’s E-CAP silicon capacitors provide wide bandwidth low impedance highly stable decoupling capacitors capable of being placed close and even integrated into an SoC substrate.

Empower Semiconductor is developing power management solutions enabling full unrestricted speed and performance of the latest xPUs.

  • High power density
  • High bandwidth conversion
  • Low power distribution losses
  • Vertical Power

The ability to process data and perform complex calculations at high speeds has been intensified in recent years by leaps in technologies such as artificial intelligence, 3-D imaging and autonomous driving. These technologies have exacerbated the need for faster and more complex processors and architectures.

Equipment designed to operate within a high magnetic field environment can experience power failures or abnormal operating conditions due to the force the magnetic field imposes on ferromagnetic material-based electronics.

Moreover, magnetic resonance imaging (MRI) devices can record false or distorted images due to the inferences from such electronics. Empower’s IVRs regulators use non-ferromagnetic air-core inductors ideal for operating in harsh magnetic environments.

Data being communicated and processed around the globe is rapidly growing, driving the need for a new generation of faster data processing components and elements in data centers and datacom equipment.

Empower Semiconductor offers novel fully integrated power management solutions that both increase performance and solve the power density challenge of space-constrained data-intensive applications.

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System-on-Modules (SOMs) and Computer-on-Modules (CoMs) provide all components of an embedded processing system (processors, communication interfaces, memory blocks, power management, etc.) on a single production-ready printed circuit board (PCB). This modular approach makes them ideal for embedding into a variety of end systems and applications.Empower’s IVRs provide high-density configurable multi-rails regulators enabling rapid and flexible prototyping.

Chiplet architectures are rapidly gaining popularity over monolithic designs in developing complex SoCs. While providing increased performance, design flexibility and upgradability, they do, however, require more complex power management and PCB routing.

Empower’s IVRs can be integrated as an additional chiplet into an SoC increasing the power delivery efficiency and simplifying PCB routing.


Empower IVR




零件号描述VR 调节输出VR1 lout [A]VR2 lout [A]VR3 lout [A]Vout 最低限度 [V]Vout 最大 [V]包装类型包装尺寸 (L x W) [mm]包装厚度 [mm]产品简介
EP7010CSingle Output 10A IVR110------0.501.20FcCSP5 x 50.75下载
EP7010BSingle Output 10A IVR on Interposer110------0.501.20LGA8 x 102.45下载
EP7015CSingle Output 5A IVR15------0.501.20FcCSP5 x 50.75下载
EP7024CDual Output 6A Packaged IVR233---0.501.20FcCSP5 x 50.75下载
EP7027CDual Output 10A IVR2820.501.20FcCSP5 x 50.75下载


Dual Output 10A IVR on Interposer282---0.501.20LGA8 x 102.45下载
EP7028CDual Output 10A Packaged IVR2640.501.20FcCSP5 x 50.75下载
EP7029BDual Output 10A IVR on Interposer2550.501.20LGA8 x 102.45下载
EP7029CDual Output 10A Packaged IVR255---0.501.20FcCSP5 x 50.75下载
EP7037BTriple Output 10A IVR on Interposer36220.501.20LGA8 x 102.45下载
EP7038BTriple Output 10A IVR on Interposer34230.501.20LGA8 x 102.45下载
EP7032CTriple Output 6A Packaged IVR32220.501.20FcCSP5 x 50.75下载
EP7037CTriple Output 10A Packaged IVR36220.501.20FcCSP5 x 50.75下载
EP7038CTriple Output 10A Packaged IVR34240.501.20FcCSP5 x 50.75下载