High-speed designs use digital components with very fast edge rates in their output signals which can be subjected to significant distortion and degradation creating high bit-error-rates and lower data throughput.  Insertion and reflection losses, crosstalk and impedance mismatch, are all factors, amongst others, influencing the integrity of a transmitted signal.

Empower’s E-CAP silicon capacitors provide wide bandwidth low impedance highly stable decoupling capacitors capable of being placed close and even integrated into an SoC substrate.

Empower Semiconductor is developing power management solutions enabling full unrestricted speed and performance of the latest xPUs.

  • High power density
  • High bandwidth conversion
  • Low power distribution losses
  • Vertical Power

The ability to process data and perform complex calculations at high speeds has been intensified in recent years by leaps in technologies such as artificial intelligence, 3-D imaging and autonomous driving. These technologies have exacerbated the need for faster and more complex processors and architectures.

Equipment designed to operate within a high magnetic field environment can experience power failures or abnormal operating conditions due to the force the magnetic field imposes on ferromagnetic material-based electronics.

Moreover, magnetic resonance imaging (MRI) devices can record false or distorted images due to the inferences from such electronics. Empower’s IVRs regulators use non-ferromagnetic air-core inductors ideal for operating in harsh magnetic environments.

Data being communicated and processed around the globe is rapidly growing, driving the need for a new generation of faster data processing components and elements in data centers and datacom equipment.

Empower Semiconductor offers novel fully integrated power management solutions that both increase performance and solve the power density challenge of space-constrained data-intensive applications.

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System-on-Modules (SOMs) and Computer-on-Modules (CoMs) provide all components of an embedded processing system (processors, communication interfaces, memory blocks, power management, etc.) on a single production-ready printed circuit board (PCB). This modular approach makes them ideal for embedding into a variety of end systems and applications.Empower’s IVRs provide high-density configurable multi-rails regulators enabling rapid and flexible prototyping.

Chiplet architectures are rapidly gaining popularity over monolithic designs in developing complex SoCs. While providing increased performance, design flexibility and upgradability, they do, however, require more complex power management and PCB routing.

Empower’s IVRs can be integrated as an additional chiplet into an SoC increasing the power delivery efficiency and simplifying PCB routing.

光纤收发器

广泛用于数据中心,光收发模块将来自交换机、路由器或其他网络设备的电信号转换为可通过高速光纤连接传输的光信号。随着收发器数据速度不断提高,达到甚至超过 400Gbps,模块电源要求也随之提高。然而,由于此类模块必须符合行业标准的外形尺寸,没有多余的的空间来容纳更大的电源。因此,效率和功率密度是首要的设计考虑因素。

这就是为什么紧凑、高效的集成电压变换器(IVRs)不需要外部元件,是创建当今光收发模块所需的许多电压轨的完美选择。

一个典型的光收发模块电源要求将有许多不同的电压轨,它们都需要从单一的3.3V系统输入中获得。下表说明了这种要求的一个例子,它要求总输出功率小于12W。

传统的解决方案至少需要三个电源管理集成电路(PMIC)和50多个其他电感和无源元件。然而,如下图所示,选择Empower的集成电压变换器(IVR)技术可将其减少到只有两个IVR和12个其他元件。其结果是大大减少了BOM,并减少了64%的电路板空间。