Media Coverage

| 05–19–26

Analog Devices to Acquire Empower Semiconductor, Expanding its Next-Generation High-Density Power Portfolio for the AI Era

Media Coverage

| 03–26–26

A Look into Commercially Available IVRs

Press Release

| 03–10–26

Empower Semiconductor Showcases Vertical Power Delivery Innovations at APEC 2026 

Two APEC industry sessions and next-generation current density advances underscore Empower’s leadership in powering kilowatt-class AI processors  MILPITAS, Calif. –

Media Coverage

| 02–13–26

EDN announces winners of the 2025 Product of the Year Awards

Press Release

| 02–10–26

Empower Introduces High-Density Embedded Silicon Capacitors to Advance Next-Generation AI and HPC Performance

Empower Semiconductor will present the latest power delivery network–optimization strategies at Chiplet Summit and DesignCon 2026 MILPITAS, Calif. – February

Media Coverage

| 02–03–26

Why power delivery is becoming the limiting factor for AI

Media Coverage

| 12–23–25

AI Will Dominate the New Year

Press Release

| 12–09–25

Empower Semiconductor Expands Global Footprint with New Silicon Valley Headquarters and Munich R&D Office

Scaling a dramatic increase in engineering capacity to meet AI and hyperscaler demand Milpitas, Calif. – December 9, 2025 – Empower

Media Coverage

| 11–13–25

Noise: A Chip Killer

Media Coverage

| 10–16–25

Current Problems Grow For Power Delivery

Press Release

| 09–29–25

Empower Semiconductor Expands Board of Directors with Industry Veterans

San Jose, Calif. – September 29, 2025 – Empower Semiconductor, the world leader in powering AI-class processors, today announced the

Press Release

| 09–24–25

Empower Sets New Benchmark with 20x Faster Response and Breakthrough Sustainability Demonstrated at OCP Global Summit 2025

San Jose, Calif. – September 24, 2025 – Empower Semiconductor, the world leader in powering AI-class processors, announced today that