ECAP IVR

High-speed designs use digital components with very fast edge rates in their output signals which can be subjected to significant distortion and degradation creating high bit-error-rates and lower data throughput.  Insertion and reflection losses, crosstalk and impedance mismatch, are all factors, amongst others, influencing the integrity of a transmitted signal.

Empower’s E-CAP silicon capacitors provide wide bandwidth low impedance highly stable decoupling capacitors capable of being placed close and even integrated into an SoC substrate.

Empower Semiconductor is developing power management solutions enabling full unrestricted speed and performance of the latest xPUs.

  • High power density
  • High bandwidth conversion
  • Low power distribution losses
  • Vertical Power

The ability to process data and perform complex calculations at high speeds has been intensified in recent years by leaps in technologies such as artificial intelligence, 3-D imaging and autonomous driving. These technologies have exacerbated the need for faster and more complex processors and architectures.

Equipment designed to operate within a high magnetic field environment can experience power failures or abnormal operating conditions due to the force the magnetic field imposes on ferromagnetic material-based electronics.

Moreover, magnetic resonance imaging (MRI) devices can record false or distorted images due to the inferences from such electronics. Empower’s IVRs regulators use non-ferromagnetic air-core inductors ideal for operating in harsh magnetic environments.

Data being communicated and processed around the globe is rapidly growing, driving the need for a new generation of faster data processing components and elements in data centers and datacom equipment.

Empower Semiconductor offers novel fully integrated power management solutions that both increase performance and solve the power density challenge of space-constrained data-intensive applications.

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System-on-Modules (SOMs) and Computer-on-Modules (CoMs) provide all components of an embedded processing system (processors, communication interfaces, memory blocks, power management, etc.) on a single production-ready printed circuit board (PCB). This modular approach makes them ideal for embedding into a variety of end systems and applications.Empower’s IVRs provide high-density configurable multi-rails regulators enabling rapid and flexible prototyping.

Chiplet architectures are rapidly gaining popularity over monolithic designs in developing complex SoCs. While providing increased performance, design flexibility and upgradability, they do, however, require more complex power management and PCB routing.

Empower’s IVRs can be integrated as an additional chiplet into an SoC increasing the power delivery efficiency and simplifying PCB routing.

Industry’s highest performance and most compact capacitor technology enables new levels of power and signal integrity

The New Silicon Capacitor Revolution

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Empower high-density E-CAP™ technology integrates into a monolithic device multiple discrete capacitances.

Compared to the ubiquitous multilayer ceramic capacitors (MLCC), E-CAP offers vastly improved electrical and mechanical performance:

 

  • 5x greater density
  • No AC/DC, temperature or aging derating
  • Ultra-low 15pH ESL
  • Ultra-wide bandwidth
  • 50μm or lower thickness capable
  • No audible noise susceptibility

The superior E-CAP stability allows to reduce the nominal capacitance needed to guarantee the effective capacitance required by the system. And with their compact form, thinness and improved electrical performance, E-CAP products are perfectly suited for high-frequency/high-speed data intensive power-hungry applications where power and signal integrity is critical.

Standard products

Empower offers standard E-CAP products adequate for a wide variety of applications. The product selector table below lists our current product selection.

Custom products

Empower E-Cap technology can be customized to various form factors and package options to fit specific applications and performance levels. In most cases, samples are available in less than 4 months. Contact us using the form below for an initial assessment of your project.

Part NumberDescription# of CapacitorsCapacitanceOperating VoltagePackage TypePackage Size (L x W) [mm]Package Thickness [μm]DownloadInquire/Buy
EC1001PUltra-low profile 200nF Silicon Capacitor1200nF4.0VCSP1.0 x 0.5 (0402/1005m)150
EC1002PUltra-low profile 215nF Silicon Capacitor1215nF4.0VCSP1.0 x 0.5 (0402/1005m)150
EC1004Ultra-low profile silicon capacitor1240nF4.0VCSP0.64 x 0.5150
EC1005Ultra-low profile silicon capacitor116.6uF2.0VCSP3.675 x 3.06784
EC2012Ultra-low profile silicon capacitor22x 1.2nF4.0VCSP0.5 x 0.25100
EC1100PUltra-low profile 670nF Silicon Capacitor Array5110nF x 3, 145nF and 200nF4.0VCSP2.5 x 0.6150
EC2047BUltra-low profile 4,800nF Silicon Capacitor Array171x 600nF, 11x 200nF, 5x 400nF2.0VCSP2.3 x 1.9200

E-CAP™ Product Inquiry

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