High-speed designs use digital components with very fast edge rates in their output signals which can be subjected to significant distortion and degradation creating high bit-error-rates and lower data throughput.  Insertion and reflection losses, crosstalk and impedance mismatch, are all factors, amongst others, influencing the integrity of a transmitted signal.

Empower’s E-CAP silicon capacitors provide wide bandwidth low impedance highly stable decoupling capacitors capable of being placed close and even integrated into an SoC substrate.

Empower Semiconductor is developing power management solutions enabling full unrestricted speed and performance of the latest xPUs.

  • High power density
  • High bandwidth conversion
  • Low power distribution losses
  • Vertical Power

The ability to process data and perform complex calculations at high speeds has been intensified in recent years by leaps in technologies such as artificial intelligence, 3-D imaging and autonomous driving. These technologies have exacerbated the need for faster and more complex processors and architectures.

Equipment designed to operate within a high magnetic field environment can experience power failures or abnormal operating conditions due to the force the magnetic field imposes on ferromagnetic material-based electronics.

Moreover, magnetic resonance imaging (MRI) devices can record false or distorted images due to the inferences from such electronics. Empower’s IVRs regulators use non-ferromagnetic air-core inductors ideal for operating in harsh magnetic environments.

Data being communicated and processed around the globe is rapidly growing, driving the need for a new generation of faster data processing components and elements in data centers and datacom equipment.

Empower Semiconductor offers novel fully integrated power management solutions that both increase performance and solve the power density challenge of space-constrained data-intensive applications.

Click for more

System-on-Modules (SOMs) and Computer-on-Modules (CoMs) provide all components of an embedded processing system (processors, communication interfaces, memory blocks, power management, etc.) on a single production-ready printed circuit board (PCB). This modular approach makes them ideal for embedding into a variety of end systems and applications.Empower’s IVRs provide high-density configurable multi-rails regulators enabling rapid and flexible prototyping.

Chiplet architectures are rapidly gaining popularity over monolithic designs in developing complex SoCs. While providing increased performance, design flexibility and upgradability, they do, however, require more complex power management and PCB routing.

Empower’s IVRs can be integrated as an additional chiplet into an SoC increasing the power delivery efficiency and simplifying PCB routing.

Event image

Empower Semiconductor Showcases High-Density Power Chiplets and Embedded Integrated Voltage Regulators at APEC 2024

Feb 13, 2024 | Press Release

Empower enables the integration of ultra-compact and highly-efficient power management chiplets into complex SoCs simplifying the design and improving the system performance

SAN JOSE, Calif. – February 13, 2024 – Empower Semiconductor, the world leader in Integrated Voltage Regulators (IVRs), will exhibit its latest generation of IVRs at the IEEE Applied Power Electronics Conference and Exposition (APEC), taking place at the Long Beach Convention and Entertainment Center, February 25-29, 2024. Trey Roessig, Empower’s CTO and SVP of engineering, will present, “In-Package DC-DC Conversion Simplifies and Improves the Performance of Deep Submicron AI/xPU Power Domains,” on Wednesday, February 28, at 1:55pm PST as part of the industry sessions.

The company will demonstrate the latest additions to its family of IVRs at booth #2044. The ultra-fast EP71xx family of multi-rail, multi-phase regulators delivers upwards of 20W in 35mm2 and eliminates all external components, shrinking board space by 3x, to provide the most compact and highest performance solution in the industry. Now available on interposers or coupled with off-the-shelf inductors, embedded systems designers have additional choices to further simplify and accelerate the design-in process while raising the bar for efficiency. Combined with its ECAP ultra-low ESL silicon capacitor products, Empower’s power management solutions achieve an unprecedented level of compactness and performance for any space constrained data-intensive applications.

During the industry sessions, Trey Roessig will discuss design challenges of current and next-generation performance AI/xPU products manufactured on the latest FinFET processes, which feature increased package complexity and the proliferation of external voltage converters. Roessig will describe technologies that allow integration of the power conversion inside the product package, simplifying the power delivery network and reducing the power train parasitics, package ball count and printed circuit board space.

“By looking at power delivery as a whole, Empower is able to optimize the power system rather than individual components. Our solutions provide a level of elegance, simplicity and performance that is unmatched,” stated Roessig. “That same technology is now being integrated as a power chiplet into chiplet-based architectures, eliminating multiple external regulators and simplifying the power delivery network.”

Schedule a meeting with Empower Semiconductor at APEC here. To learn more about Empower Semiconductor’s solutions, visit www.empowersemi.com.                                                                                   

# # #                                

About Empower Semiconductor

Data being communicated and processed around the globe is anticipated to drive the energy consumption of data centers and communications networks to 17% of total electricity demand worldwide by 20301, dramatically increasing pollution, carbon emissions and cost. Empower Semiconductor was founded with the mission to “minimize the energy footprint of the digital economy” by developing novel, fully integrated power management solutions that increase the performance and reduce the power consumption of energy-hungry, data-intensive applications.

Traditional power solutions require dozens of discrete components with big footprints, complex designs and deliver power inefficiently with poor response times and inaccuracies. Empower Semiconductor’s patented IVR technology integrates dozens of components into a single IC, shrinking footprints by 3x, increasing efficiency and delivering power with unprecedented simplicity, speed & accuracy and with zero discrete components. The Empower IVR technology solves the power density challenge to address a wide range of applications including mobile, wearables, 5G, AI, and data centers. In 2020 the capacitor technology platform was added to further address power density. ECAP revolutionized the capacitor industry as the world’s smallest, highest performing, and incredibly reliable capacitor for wearables, mobile, and SoC applications. The company is based in Silicon Valley, CA and is led by a team of highly experienced power experts and executives.

1Nature, “How to stop data centers from gobbling up the world’s electricity”, September 12, 2018.

Empower Semiconductor and the Empower logo are trademarks or registered trademarks of Empower Semiconductor, Inc. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners.