High-speed designs use digital components with very fast edge rates in their output signals which can be subjected to significant distortion and degradation creating high bit-error-rates and lower data throughput.  Insertion and reflection losses, crosstalk and impedance mismatch, are all factors, amongst others, influencing the integrity of a transmitted signal.

Empower’s E-CAP silicon capacitors provide wide bandwidth low impedance highly stable decoupling capacitors capable of being placed close and even integrated into an SoC substrate.

Empower Semiconductor is developing power management solutions enabling full unrestricted speed and performance of the latest xPUs.

  • High power density
  • High bandwidth conversion
  • Low power distribution losses
  • Vertical Power

The ability to process data and perform complex calculations at high speeds has been intensified in recent years by leaps in technologies such as artificial intelligence, 3-D imaging and autonomous driving. These technologies have exacerbated the need for faster and more complex processors and architectures.

Equipment designed to operate within a high magnetic field environment can experience power failures or abnormal operating conditions due to the force the magnetic field imposes on ferromagnetic material-based electronics.

Moreover, magnetic resonance imaging (MRI) devices can record false or distorted images due to the inferences from such electronics. Empower’s IVRs regulators use non-ferromagnetic air-core inductors ideal for operating in harsh magnetic environments.

Data being communicated and processed around the globe is rapidly growing, driving the need for a new generation of faster data processing components and elements in data centers and datacom equipment.

Empower Semiconductor offers novel fully integrated power management solutions that both increase performance and solve the power density challenge of space-constrained data-intensive applications.

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System-on-Modules (SOMs) and Computer-on-Modules (CoMs) provide all components of an embedded processing system (processors, communication interfaces, memory blocks, power management, etc.) on a single production-ready printed circuit board (PCB). This modular approach makes them ideal for embedding into a variety of end systems and applications.Empower’s IVRs provide high-density configurable multi-rails regulators enabling rapid and flexible prototyping.

Chiplet architectures are rapidly gaining popularity over monolithic designs in developing complex SoCs. While providing increased performance, design flexibility and upgradability, they do, however, require more complex power management and PCB routing.

Empower’s IVRs can be integrated as an additional chiplet into an SoC increasing the power delivery efficiency and simplifying PCB routing.

Empower Semiconductor to Present at Chiplet Summit 2024 on Eliminating External Regulators in Chiplet Architectures

Jan 25, 2024 | Press Release

Multi-phase and multi-rail Integrated Voltage Regulators (IVRs) bring performance, scalability and footprint reduction to chiplet-based multicore systems

SAN JOSE, Calif. – January 25, 2024 – Empower Semiconductor, the world leader in integrated voltage regulators (IVRs), will present a technical paper on the benefits of IVRs at the upcoming Chiplet Summit, taking place at the Santa Clara Convention Center, February 6-8, 2024. Trey Roessig, Empower’s CTO and SVP of engineering, will discuss “Using Integrated Voltage Regulators in Chiplet Design,” on Wednesday, February 7, at 3:15 p.m. PST, as part of the design/security track.

Empower IVRTM technology features a novel and advanced power management architecture that delivers power with simplicity, speed and accuracy in a compact single IC with no external discrete components. These devices can be used for traditional system power in space-constrained applications as well as integrated as a power chiplet into an SoC or chiplet-based architecture. Combined with Empower’s E-CAP™ silicon capacitor products, in-package integrated voltage regulators achieve an unprecedented level of compactness, performance and power integrity.

Power delivery challenges have been exacerbated by the proliferation of chiplet-based multicore designs. The disparate nature of chiplets typically commands various power domains, often with their own unique requirements, making power conversion design a large contributor to the solution footprint. Empower Semiconductor’s presentation will examine how high-frequency IVRs can now integrate inside a package as a power chiplet, eliminating most external power converters and bulky inductors. This approach simplifies package design by removing multiple dedicated power balls and external traces, which reduces transmission losses and improves transient performance.

“Our IVRs not only increase the overall performance of chiplet-based devices, they also greatly simplify the implementation of the multiple power domains required. We save critical board space and power engineers are surprised at how seamless and flexible designing in-package power conversion is,” said Roessig. “We are excited to present the unique benefits of the Empower IVR technology at the upcoming Chiplet Summit.”

Visit www.chipletsummit.com to find out more about the event. To learn more about Empower Semiconductor’s solutions, visit www.empowersemi.com.                                                                      

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About Empower Semiconductor

Data being communicated and processed around the globe is anticipated to drive the energy consumption of data centers and communications networks to 17% of total electricity demand worldwide by 20301, dramatically increasing pollution, carbon emissions and cost. Empower Semiconductor was founded with the mission to “minimize the energy footprint of the digital economy” by developing novel, fully integrated power management solutions that increase the performance and reduce the power consumption of energy-hungry, data-intensive applications.

Traditional power solutions require dozens of discrete components with big footprints, complex designs and deliver power inefficiently with poor response times and inaccuracies. Empower Semiconductor’s patented IVR technology integrates dozens of components into a single IC, shrinking footprints by 3x, increasing efficiency and delivering power with unprecedented simplicity, speed & accuracy and with zero discrete components. The Empower IVR™ technology solves the power density challenge to address a wide range of applications including mobile, wearables, 5G, AI, and data centers. In 2020 the capacitor technology platform was added to further address power density. E-CAP revolutionized the capacitor industry as the world’s smallest, highest performing, and incredibly reliable capacitor for wearables, mobile, and SoC applications. The company is based in Silicon Valley, CA and is led by a team of highly experienced power experts and executives.

1Nature, “How to stop data centers from gobbling up the world’s electricity”, September 12, 2018.

Empower Semiconductor, Empower IVR and the Empower logo are trademarks or registered trademarks of Empower Semiconductor, Inc. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners.